PART |
Description |
Maker |
TO263 |
Package Outline Drawing Transistor Outline 封装外形图晶体管外形
|
Electronic Theatre Controls, Inc. ETC List of Unclassifed Manufacturers
|
MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
ICS280PGLF ICS280 ICS280PG ICS280PGILF ICS280PGI |
From old datasheet system Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) 封装和封装尺寸(16引脚TSSOP封装173军医。体
|
Integrated Circuit Solu... ICSI[Integrated Circuit Solution Inc] Intersil, Corp.
|
SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
SC70-6 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装(SSOP封装),EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp. Fairchild Semiconductor Corporation
|
TQFN5X5-32 |
Package Outline
|
Global Mixed-mode Techn...
|
SOP-7 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN3X3-12 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN3X4-20 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP11X12-132 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-28 |
Package Outline
|
Global Mixed-mode Techn...
|